It is measured in inches.Īrray Y Dimension: The extreme array measurement along the Y axis is termed as array Y dimension. This is normally associated with statistically derived parts sampling.Īrray: Array refers to the group of circuits that are arranged in a certain pattern.Īrray Up: These are individual PCBs available in the array configuration.Īrray X Dimension: The extreme array measurement along the X axis, including borders or rails is termed as array X dimension. In short, this list comprises the size and shape of D codes.Īcceptance Quality Level (AQL): AQL is the maximum permissible, and tolerable level of defects in a lot. It is also referred to as D: code list.Īperture List/Aperture Table: This is an ASCII text data file comprising information regarding the apertures used by a photoplotter for any one photoplot. This is used as a basic element in plotting geometric elements on a film.Īperture Wheel: A vector photoplotter metal disk component with screw holes and cutouts with brackets that are placed near rims for aperture attachment.Īperture Information: The text file featuring the shape and size of each board element. The index of the aperture is usually its D code. This method is employed to produce BUM PCBs with inter connecting inner layers in extremely high density.Īperture: This is an indexed shape with specific length and width dimensions. For PCBs using ALIVH, electrical connection is established between layers through soldering rather than vias or core board. Anodes are used to accelerate the movement of metal ions towards the panel of the circuit board being plated.Īnti-Solder Ball: It is a major technique employed during Surface Mount Technology (SMT) to limit the amount of tin that passes through the stencil.Īnti-Tarnish: This is a chemical process conducted post dip to reduce oxidation of copper circuits.Īny layer inner via Hole: Abbreviated as ALIVH, this technology is used for building multilayer PCB without a core. It is connected to the positive potential. Alumina can withstand low dielectric loss over a wide range of frequencies, as well as extreme temperatures.Īmbient: It refers to a surrounding environment that comes in contact with the component or system under consideration.Īnalog Circuit: In this circuit, the output signals vary as the continuous function of the input.Īnnular Ring: Annular ring is a circular pad made from conductive material, which surrounds a hole.Īnode: Anode is a positive element in the plating tank. This method is also known as seeding, catalyzing, and sensitizing.Īdditive Process: As the name suggests, this process is employed in multi-layer boards for plating-through (non-conductive) holes to create vias.ĪIN: AIN is aluminum nitride, which is a compound of nitrogen and aluminum.ĪIN Substrate: This is an aluminum nitride substrate.Īlumina: Alumina is a type of ceramic that is used as a substrate in thin film circuit or insulator in electron tubes. Conductive material is deposited onto clad or unclad base material. Also, the active components can be referred to as ones that don’t include capacitor, resistor, and inductor.Īctivating: This is a chemical treatment method employed to improve receptiveness of non-conductive laminates. Examples of active devices include, silicon controlled rectifiers, transistors, valves, etc. A B C D E F G H I J K L M N O P Q R S T U V W X Y ZĪctive Component: A component that depends on its external power source to activate its inputs.
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